1. 2. 3. material content data sheet sales product name tle6232gp issued 28. august 2013 ma# MA000691392 package pg-dso-36-48 weight* 2047.14 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 17.568 0.86 0.86 8582 8582 leadframe inorganic material phosphorus 7723-14-0 0.383 0.02 187 non noble metal zinc 7440-66-6 1.533 0.07 749 non noble metal iron 7439-89-6 30.652 1.50 14973 non noble metal copper 7440-50-8 1244.598 60.78 62.37 607969 623878 wire non noble metal copper 7440-50-8 2.640 0.13 0.13 1289 1289 encapsulation organic material carbon black 1333-86-4 1.440 0.07 703 plastics epoxy resin - 66.224 3.24 32350 inorganic material silicondioxide 60676-86-0 652.164 31.86 35.17 318574 351627 leadfinish non noble metal tin 7440-31-5 16.150 0.79 0.79 7889 7889 plating noble metal silver 7440-22-4 0.741 0.04 0.04 362 362 solder noble metal silver 7440-22-4 0.196 0.01 96 non noble metal tin 7440-31-5 0.130 0.01 64 non noble metal lead 7439-92-1 12.718 0.62 0.64 6213 6373 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
